16 Fiber Photonic-Plug
A fiber connector product for assembly of optical fibers with silicon photonics chip.
The product is optimized for transceivers and co-packaged optics stacks with high compatibility to flip-chip and reflow packaging processes.
High assembly tolerance better than ±20µm / 1dB for assembling single-mode fiber ribbon to a silicon photonics chip.
Supports 16 fibers, silicon photonics packaging for transceiver (direct bonding) and co-packaged optics (detachable) products.
Uses Self-aligning optics for passive assembly protocols and supports high volume packaging using standard semiconductors manufacturing and packaging flows.
Supports wavelength division multiplexing (WDM) die stacking with surface-coupling geometries.
Incorporates wafer level optical elements for seamless integration of optical and electrical bumps.
|Fiber Arrangement||Fiber type||SM and PM (different combinations)|
|Fiber ribbon length||5 cm (Typical) – Bonded Plug|
|50 cm (Typical) – Detachable Plug|
|Fiber ribbon termination||MPO (Typical), other connectors possible|
|Optical Characteristics||Photonic-Plug Insertion Loss||< 1 dB|
|Detachable Pair Insertion Loss||< 1 dB|
|Operating Frequencies||O and C bands|
|Back Reflection||< 45 dB|
|Footprint||Photonic-Plug Dimensions (WxDxH)||3.0 x 3.9 x 1.0 mm (127 µm pitch)|
|5.0 x 3.9 x 1.0 mm (250 µm pitch)|
|Photonic-Plug assembly on PIC||Assembly method||* Passive assembly via machine vision (Direct Bonding)|
|* Manual cable connectivity (Detachable Connector to Receptacle)|
|PIC Connectivity||* Adhesive (Direct Bonding)|
|* Detachable (Connectorized)|
|Photonic-Plug assembly tolerances||XY-Plane||±20 µm / 1 dB loss|
|Z-Plane||±10 µm / 1 dB loss|
|Rotation||±1 deg / 0.5 dB loss|
|Tilt||±2 mRad / 0.3 dB loss|
- Transceivers – Scalable fiber assembly for silicon photonics 400G, 800G, 1.6T, 3.2T transceivers.
- Co-Packaged Optics – Detachable scalable connectivity for highest Gbps/mm, tailored for high capacity network processors (51.2T, 102.4T and beyond).