16 Fiber Photonic-Plug
A fiber connector product for assembly of optical fibers with silicon photonics chip.
The product is optimized for transceivers and co-packaged optics stacks with high compatibility to flip-chip and reflow packaging processes.
Key Features
High assembly tolerance better than ±20µm / 1dB for assembling single-mode fiber ribbon to a silicon photonics chip.
Supports 16 fibers, silicon photonics packaging for transceiver (direct bonding) and co-packaged optics (detachable) products.
Uses Self-aligning optics for passive assembly protocols and supports high volume packaging using standard semiconductors manufacturing and packaging flows.
Supports wavelength division multiplexing (WDM) die stacking with surface-coupling geometries.
Incorporates wafer level optical elements for seamless integration of optical and electrical bumps.
Specifications
| Parameter | Current Property | |
| Fiber Arrangement | Fiber type | SM and PM (different combinations) |
| Fiber ribbon | 16 | |
| Pitch | 127/250 µm | |
| Fiber ribbon length | 5 cm (Typical) – Bonded Plug | |
| 50 cm (Typical) – Detachable Plug | ||
| Fiber ribbon termination | MPO (Typical), other connectors possible | |
| Optical Characteristics | Photonic-Plug Insertion Loss | < 1 dB |
| Detachable Pair Insertion Loss | < 1 dB | |
| Operating Frequencies | O and C bands | |
| Back Reflection | < 45 dB | |
| Footprint | Photonic-Plug Dimensions (WxDxH) | 3.0 x 3.9 x 1.0 mm (127 µm pitch) |
| 5.0 x 3.9 x 1.0 mm (250 µm pitch) | ||
| Photonic-Plug assembly on PIC | Assembly method | * Passive assembly via machine vision (Direct Bonding) |
| * Manual cable connectivity (Detachable Connector to Receptacle) | ||
| PIC Connectivity | * Adhesive (Direct Bonding) | |
| * Detachable (Connectorized) | ||
| Photonic-Plug assembly tolerances | XY-Plane | ±20 µm / 1 dB loss |
| Z-Plane | ±10 µm / 1 dB loss | |
| Rotation | ±1 deg / 0.5 dB loss | |
| Tilt | ±2 mRad / 0.3 dB loss |
Applications
- Transceivers – Scalable fiber assembly for silicon photonics 400G, 800G, 1.6T, 3.2T transceivers.
- Co-Packaged Optics – Detachable scalable connectivity for highest Gbps/mm, tailored for high capacity network processors (51.2T, 102.4T and beyond).