32 Fiber Photonic-Plug

A fiber connector product for assembly of optical fibers with silicon photonics chip.

The product is optimized for co-packaged optics stacks with high compatibility to flip-chip and reflow packaging processes.

Key Features

High assembly tolerance better than ±20µm / 1dB for assembling single-mode fiber ribbon to a silicon photonics chip.

Supports 32 fibers, silicon photonics packaging for co-packaged optics (detachable) products.

Uses passive assembly protocols and supports high volume packaging using standard semiconductors manufacturing and packaging flows.

Supports wavelength division multiplexing (WDM) die stacking with surface-coupling geometries.

Incorporates wafer level optical elements for seamless integration of optical and electrical bumps.


Parameter Current Property
Fiber Arrangement Fiber type SM and PM (different combinations)
Fiber ribbon 32
Pitch 127 µm
Fiber ribbon length 50 cm (Typical) – Detachable Plug
Fiber ribbon termination MPO (Typical), other connectors possible
Optical Characteristics Photonic-Plug Insertion Loss < 1 dB
Detachable Pair Insertion Loss < 1 dB
Operating Frequencies O and C bands
Back Reflection < 45 dB
Footprint Photonic-Plug Dimensions (WxDxH) 5.1 x 3.9 x 1.0 mm
Photonic-Plug assembly on PIC Assembly method Manual cable connectivity (Detachable connector to receptacle)
PIC Connectivity Detachable (Connectorized)
Photonic-Plug assembly tolerances XY-Plane ±20 µm / 1 dB loss
Z-Plane ±10 µm / 1 dB loss
Rotation ±1 deg / 0.5 dB loss
Tilt ±2 mRad / 0.3 dB loss


  • Co-Packaged Optics – Detachable scalable connectivity for highest Gbps/mm, tailored for high capacity network processors (51.2T, 102.4T and beyond).