TeraSPOT ®

A fiber connectivity product for assembly of Single-mode (SM) optical fibers on a silicon photonics chip.

TeraSPOT provides a surface coupling solution comprised of Teramount’s Photonic-Plug and a Photonic-Bump integrated into the customer’s silicon photonics chip using either Inverse Tapered Waveguides (wideband) or Grating Couplers (narrowband).

TeraSPOT is optimized for Pluggable Transceivers use-case.

Key Features

Fully Integrated with standard semiconductor high-volume manufacturing and 2.5D/3D packaging flows, enabling vendors to finally manufacture silicon-integrated optics in high volume, with semiconductor-grade yield and reliability.

Surface Coupling for handoffs from both Inverse Tapered Waveguides (wideband) and Grating Couplers (narrowband). Enables Wafer-level and multi-stage testability.

Bonded solution perfect for Transceivers use-case. Optimized dimensions for reduced footprint.

High Bandwidth Density with 127/250µm fiber pitch and up to 16 SM fibers.

Self-aligning Optics provide huge assembly tolerances of better than ±30µm / 0.5dB for assembling SM fiber ribbon to a silicon photonics chip.