Our Technology

Seamlessly connects optics to silicon

Teramount Photonic-Plug uses multiple proprietary breakthrough technologies for scalable photonic packaging

Self-aligning optics

Patented wafer-level optics for unprecedented fiber-chip assembly

Photonic-Bump

Wafer-level optical elements for significantly increased reliability and high yield silicon photonics manufacturing, testing and packaging

Wide-band surface coupling

Wide-band surface coupling that avoids complicated side-coupling geometries

Detachable fiber connectivity

Detachable fiber connectivity optimized for co-packaged optics, high fiber count and post reflow assembly

Self-aligning optics for large assembly tolerances

“The Photonic-Plug incorporates wafer-level optical elements for enabling Teramount’s patented “self-aligning optics” technology. Such optical arrangement offers better than ±20µm / 1dB of assembly tolerances when aligning single-mode fibers to a silicon photonic chip.

The Photonic-Plug makes use of wafer-level processes for accurate placement of optical elements, thus shifting accuracy requirements from assembly to wafer manufacturing domain.

Large assembly tolerance is a key issue for the enablement of large number of fibers passive assembly protocols. In addition, it is crucial for enhancing system thermal management.”

Wafer-level manufacturing of optical elements in Teramount’s Photonic-Plug.
Measured XY fiber assembly tolerances of Teramount’s Photonic-Plug (Right) compared with the tight tolerances of direct fiber coupling (left).
Measured tolerances cross section of better than ±30µm / 0.5dB with Teramount’s Photonic-Plug.

The Photonic-Bump

Teramount’s Photonic-Bump aligns photonics with standard semiconductor manufacturing, packaging and testing flow. The Photonic-Bump is an add-on element implemented on silicon photonics wafers. It enables:

  • Beam deflection optics for wide-band surface coupling to replace the complicated side-coupling geometry.
  • Mode-conversion for matching waveguide and single-mode fiber spot sizes.
  • Large assembly tolerances via Teramount’s “Self-aligning Optics” technology.
  • Wafer-level testing, allowing surface probing of silicon photonic wafers prior to dicing.
  • Planar separation between fibers and silicon photonics chip for efficient optical and electrical packaging.
Photonic-Bump for WDM chips: Wafer-level optics for Beam-deflection, Mode-conversion and “Self-aligning Optics”.
Photonic-Bump for grating coupling-based chips: Providing Beam-expansion and "Self-aligning Optics”.
Photonic-Bump planar separation for optical and electrical packaging. All optical and electrical I/Os are connected by means of single flip-chip assembly".

Wide-band surface coupling

  • Teramount’s Photonic-Bump incorporates beam-deflection optics optimized for WDM silicon photonics chips. It enables wide-band surface-coupling, thus avoiding the complexity of typical fiber side-coupling.
  • Wide-band surface coupling provides optical access for silicon photonics wafer-level inspection.
The Photonic-Bump’s wafer-level optics enabling wide-band surface-coupling and wafer-level inspection.

Detachable fiber connectivity: Game changer for co-package optics

  • Detachable Photonic-Plug ushers in a new era of detachable and serviceable single-mode fiber connectivity for co-packaged optics.
  • Post reflow assembly, improving packaging yield.
  • Effective PIC testing pre- and post-fiber assembly through Teramount’s Photonic-Bump and planar coupling geometry.
  • Large number of fibers for co-package optics and high bandwidth applications.
  • No mid-board connector: One fiber ribbon from PIC to faceplate for higher optical throughput and improved insertion loss.
Detachable fiber connectivity: a game changer for co-package optics in networking and advanced computing applications.
Detachable Photonic-Plug: Unprecedented assembly tolerances for serviceable and detachable fiber assembly.
High yield packaging: Post-reflow assembly, pre- and post-fiber assembly testing, supporting high fiber count.

“With Teramount’s solution, photonics can now be seamlessly integrated with electronics,
providing our customers with unparalleled high bandwidth and low power consumption”