Our Technology
Seamlessly connects optics to silicon
Self-aligning optics
Photonic-Bump
Wide-band surface coupling
Detachable fiber connectivity
Self-aligning optics for large assembly tolerances
“The Photonic-Plug incorporates wafer-level optical elements for enabling Teramount’s patented “self-aligning optics” technology. Such optical arrangement offers better than ±20µm / 1dB of assembly tolerances when aligning single-mode fibers to a silicon photonic chip.
The Photonic-Plug makes use of wafer-level processes for accurate placement of optical elements, thus shifting accuracy requirements from assembly to wafer manufacturing domain.
Large assembly tolerance is a key issue for the enablement of large number of fibers passive assembly protocols. In addition, it is crucial for enhancing system thermal management.”
The Photonic-Bump
Teramount’s Photonic-Bump aligns photonics with standard semiconductor manufacturing, packaging and testing flow. The Photonic-Bump is an add-on element implemented on silicon photonics wafers. It enables:
- Beam deflection optics for wide-band surface coupling to replace the complicated side-coupling geometry.
- Mode-conversion for matching waveguide and single-mode fiber spot sizes.
- Large assembly tolerances via Teramount’s “Self-aligning Optics” technology.
- Wafer-level testing, allowing surface probing of silicon photonic wafers prior to dicing.
- Planar separation between fibers and silicon photonics chip for efficient optical and electrical packaging.
Wide-band surface coupling
- Teramount’s Photonic-Bump incorporates beam-deflection optics optimized for WDM silicon photonics chips. It enables wide-band surface-coupling, thus avoiding the complexity of typical fiber side-coupling.
- Wide-band surface coupling provides optical access for silicon photonics wafer-level inspection.
Detachable fiber connectivity: Game changer for co-package optics
- Detachable Photonic-Plug ushers in a new era of detachable and serviceable single-mode fiber connectivity for co-packaged optics.
- Post reflow assembly, improving packaging yield.
- Effective PIC testing pre- and post-fiber assembly through Teramount’s Photonic-Bump and planar coupling geometry.
- Large number of fibers for co-package optics and high bandwidth applications.
- No mid-board connector: One fiber ribbon from PIC to faceplate for higher optical throughput and improved insertion loss.
“With Teramount’s solution, photonics can now be seamlessly integrated with electronics,
providing our customers with unparalleled high bandwidth and low power consumption”