Our Technology
Seamlessly connect optics to silicon
Self-aligning optics
Photonic-Bump
Wide-band surface coupling
Detachable fiber connectivity
Self-aligning optics for large assembly tolerances
The Photonic-Plug incorporates wafer-level optical elements for enabling Teramount’s patented “self-aligning optics” technology. Such optical arrangement offers better than ±30µm / 0.5dB of assembly tolerances when aligning single-mode (SM) or polarization-maintaining (PM) fibers to a silicon photonic chip.
The Photonic-Plug makes use of wafer-level processes for accurate placement of optical elements, thus shifting accuracy requirements from assembly to wafer manufacturing domain.
Large assembly tolerance is a key issue for the enablement of large number of fibers passive assembly protocols. In addition, it is crucial for enhancing system thermal management.
The Photonic-Bump
Teramount’s Photonic-Bump aligns photonics with standard semiconductor manufacturing, packaging and testing flow. The Photonic-Bump is an add-on element implemented on silicon photonics wafers. It enables:
- Beam deflection optics for wide-band surface coupling to replace the complicated side-coupling geometry.
- Mode-conversion for matching waveguide and single-mode fiber spot sizes.
- Large assembly tolerances via Teramount’s “Self-aligning Optics” technology.
- Wafer-level testing, allowing surface probing of silicon photonic wafers prior to dicing.
- Planar separation between fibers and silicon photonics chip for efficient optical and electrical packaging.
Wide-band surface coupling
Teramount’s Photonic-Bump incorporates beam-deflection optics optimized for WDM silicon photonics chips. It enables wide-band surface-coupling, thus avoiding the complexity of typical fiber side-coupling.
Wide-band surface coupling provides optical access for silicon photonics wafer-level inspection.
Detachable fiber connectivity: Game changer for co-package optics
- Detachable Photonic-Plug ushers in a new era of detachable and serviceable single-mode fiber connectivity for co-packaged optics.
- Post reflow assembly, improving packaging yield.
- Effective PIC testing pre- and post-fiber assembly through Teramount’s Photonic-Bump and planar coupling geometry.
- Large number of fibers for co-package optics and high bandwidth applications.
- No mid-board connector: One fiber ribbon from PIC to faceplate for higher optical throughput and improved insertion loss.
providing our customers with unparalleled high bandwidth and low power consumption”