Our Technology

Seamlessly connect optics to silicon

The Universal Photonic Coupler uses multiple proprietary breakthrough technologies for scalable photonic packaging

Self-aligning optics

Patented 3D optical design for unprecedented fiber-chip assembly tolerances


Versatile design supporting various customer use-cases, optical arrangements and fiber characteristics


Wafer-level optical elements for significantly increased reliability and high yield silicon photonics manufacturing, testing and packaging

Wideband surface coupling

Wideband surface coupling that avoids complicated side-coupling geometries

Detachable fiber connectivity

Detachable fiber connectivity optimized for co-packaged optics, high fiber count and post reflow assembly

Self-aligning optics for large assembly tolerances

Teramount’s patented self-aligning optics technology, realized within the Photonic-Plug and Photonic-Bump components, offers better than ±30µm / 0.5dB of assembly tolerances when aligning single-mode (SM) or polarization-maintaining (PM) fibers to a silicon photonics chip.

Large assembly tolerances are a key issue for the enablement of large number of fibers passive assembly protocols. In addition, it is crucial for enhancing system thermal management.

Wafer-level manufacturing of optical elements in Teramount’s Photonic-Plug.
Measured XY fiber assembly tolerances of Teramount’s Universal Photonic Coupler (Right) compared with the tight tolerances of direct fiber side-coupling (left).
Measured tolerances cross-section better than ±30µm / 0.5dB with Teramount’s Universal Photonic Coupler.

The Photonic-Plug

Incorporating wafer-level optical elements for enabling
Teramount’s patented “self-aligning optics” technology.

The Photonic-Plug makes use of wafer-level processes for
accurate placement of optical elements, thus shifting
accuracy requirements from assembly to wafer
manufacturing domain.

Versatile design easily adapts to customer’s use-case and
PIC characteristics (Detachable vs. Bonded, Waveguide vs.
Grating Coupling, Fiber pitch & count, etc…).

The Photonic-Bump

Teramount’s Photonic-Bump aligns photonics with standard semiconductor manufacturing, packaging and testing flow. The Photonic-Bump is an optical element attached to the customer’s silicon photonics PIC using die-to-wafer assembly. It enables:

  • Beam deflection optics for wideband surface coupling to replace the complicated side-coupling geometry.
  • Spot-size conversion for matching waveguide and single-mode fiber spot sizes.
  • Large assembly tolerances via Teramount’s “Self-aligning Optics” technology.
  • Wafer-level testing, allowing surface probing of silicon photonics wafers prior to dicing.
  • Planar separation between fibers and silicon photonics chip for efficient optical and electrical packaging.
Photonic-Bump for WDM chips: Wafer-level optics for Beam-deflection, Spot-size conversion and “Self-aligning Optics”.
Photonic-Bump for grating coupling-based chips: Providing Beam-expansion and "Self-aligning Optics”.
Photonic-Bump planar separation for optical and electrical packaging. All optical and electrical I/Os are connected by means of single flip-chip assembly.

Wideband surface coupling

Teramount’s Universal Photonic Coupler incorporates beam-deflection optics optimized for WDM silicon photonics chips. It enables wideband surface-coupling, thus avoiding the complexity of typical fiber side-coupling.

Wideband surface coupling provides optical access for silicon photonics wafer-level inspection.

The Photonic-Bump’s wafer-level optics enabling wideband surface-coupling and wafer-level inspection.

Detachable fiber connectivity:
Game changer for co-packaged optics

  • Detachable Universal Photonic Coupler ushers in a new era of detachable and serviceable fiber connectivity for co-packaged optics.
  • Post reflow assembly, improving packaging yield.
  • Effective PIC testing pre- and post-fiber assembly through Teramount’s Photonic-Bump and planar coupling geometry.
  • Large number of fibers for co-packaged optics and high bandwidth applications.
  • No mid-board connector: One fiber ribbon from PIC to faceplate for higher optical throughput and improved insertion loss.
Detachable fiber connectivity: a game changer for co-package optics in networking and advanced computing applications.
Detachable Photonic-Plug: Unprecedented assembly tolerances for serviceable and detachable fiber assembly.
High yield packaging: Post-reflow assembly, pre- and post-fiber assembly testing, supporting high fiber count.
“With Teramount’s solution, photonics can now be seamlessly integrated with electronics,
providing our customers with unparalleled high bandwidth and low power consumption”