Our Technology
Seamlessly connects optics to silicon
Self-aligning optics
PhotonicBump
Wide-band surface coupling
Detachable fiber connectivity
Self-aligning optics for large assembly tolerances
PhotonicPlug incorporates a wafer level optical elements for enabling Teramount patented “self-aligning optics” scheme. Such optical arrangement offers >±20um/1dB of assembly tolerances when aligning single-mode fiber to a silicon photonic chip.
PhotonicPlug takes advantage from wafer level processes for accurate placement of optical elements thus shifts accuracy requirements from assembly to wafer manufacturing domain
Large assembly tolerance is a key issue for enablement of large number of fibers passive assembly protocols. In addition, it is crucial for enhancing system thermal management.
PhotonicBump technology
PhotonicBump aligns photonics with standard semiconductor manufacturing, packaging and testing flow. PhotonicBump is an add-on element implemented on silicon photonics wafers. It allows:
- Beam deflection optics for wide-band surface coupling to replace the complicated side-coupling geometry.
- Mode-conversion for matching waveguide and single-mode fiber spot sizes.
- Large assembly tolerances: through the “self-aligning” optical arrangement.
- Wafer level testing: allows surface probing of silicon photonic wafer prior dicing.
- Planer separation between fibers and silicon photonic chip for efficient optical and electrical packaging.
Wide-Band Surface Coupling
PhotonicBump incorporates beam deflection optics optimized for WDM silicon photonic chip. It enables wide-band surface coupling thus avoids the complexity of typical fiber’s side coupling.
Wide-band surface coupling provides optical access for silicon photonics wafer level inspection.
Detachable fiber connectivity: Game changer for co-package optics
Detachable PhotonicPlug: enables a new era of detachable and serviceable single-mode fiber connectivity for co-packaged optics.
Post reflow assembly: Detachable PhotonicPlug enables post-reflow fiber assembly thus improves packaging yield.
Effective testing: enables PIC testing pre and post fiber assembly through its PhotonicBump and planner coupling geometry.
Large number of fibers: enables fiber high count for co-package optics and high bandwidth applications.
No mid-board connector: one fiber connector to faceplate for higher optical throughput.