Teramount News
Recent highlight
Teramount unveils TeraVERSE: The only HVM-ready detachable fiber connectivity solution for CPO
TeraVERSE bonds the semiconductor and optical worlds seamlessly and utilizes wafer-level optical elements integrated into the customer’s Silicon...
Recent news
Teramount, the leader in scalable fiber connectivity to chips, announced today that it is collaborating with GlobalFoundries (GF) to address the challenge of connecting fibers...
Processors continue to scale their performance with each new generation. This rapid advancement necessitates a corresponding increase in the rate of traffic to and from...
In the contemporary digital landscape, where artificial intelligence (AI) and machine learning (ML) are no longer just buzzwords but essential components of our daily lives...
We are honored and excited to have TeraVERSE, our detachable fiber connector for CPO, selected by Lightwave Innovation...
The relentless pursuit of higher data throughput and efficiency in the digital age has brought the limitations of traditional data transmission technologies into sharp relief...
Teramount features its innovative detachable fiber connector to chip, supporting an industry-first 32+ SM/PM mix of fibers at...
Teramount Ltd. and ASMPT AMICRA GmbH are collaborating to address the challenge of connecting fibers to silicon photonic...
Abstract: To overcome the bandwidth constraints of copper interconnects and pluggable optics in next-generation data centers, particularly for...
Teramount and Tower Semiconductor have recently announced their collaboration on integrating Teramount’s state-of-the-art self-aligning optics solution into Tower’s...
Teramount Ltd. and I-PEX Inc. are collaborating to advance SiPh CPO optical detachable connectivity for data centers and...
Read Roy Rubenstein’s blog and interview with Hesham Taha, our CEO, describing Teramount’s technology and advancements so far,...
Teramount: An optical connectivity chip for high-speed data transfer in datacenters Datacenters are constantly battling bottlenecks. Although chips...
Check out our recent publication in Chip Scale Review where you can learn about Teramount’s groundbreaking Photonic Bump technology. The...
Read Michael Eisenstein’s piece about Teramount’s exciting technology and how it relates to fabrication trends in light of...
Teramount demoes its Photonic-Plug fiber assembly solution with unprecedented tolerance and insertion loss performance.
ST. FLORIAN, Austria and JERUSALEM, March 2, 2022 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer...
Data Centers, dedicated spaces used to house computer systems and related components, have become crucial for IT infrastructure...
A small Israeli start-up focusing on fiber-to-silicon connectivity solutions for ultra–high bandwidth applications has raised $8 million that...
Jerusalem-based Teramount, a provider of connectivity solutions for ultra-high bandwidth applications, announced on Tuesday that it had completed...