JERUSALEM, Israel – March 26, 2024 – Teramount, the leader in scalable fiber connectivity to chips, announced today that it is collaborating with GlobalFoundries (GF) to address the challenge of connecting fibers to Silicon Photonics (SiPh) chips, to meet the ever-growing bandwidth demands and power challenges in datacom and telecom applications.

As part of this collaboration, Teramount integrates its Universal Photonic Coupler solution with GF’s 45CLO silicon photonics platform, GF Fotonix^TM, to provide a scalable fiber packaging solution to customers who want to utilize high-speed optical connectivity for applications like AI/ML and data center. This collaboration will enable deeper integration of optics into semiconductors through a variety of innovative packaging technologies which provide scalability of bandwidth, power and latency performance to next generations of advanced computing applications.

“Customers are very impressed with our connectivity solution” said Hesham Taha, Teramount’s President and CEO, “and they want to see it supported by leading foundries. GF’s feature-rich 45CLO Fotonix platform and position as a leading silicon photonics foundry, make them an ideal partner for high volume manufacturing of Teramount’s solution “.

“GF Fotonix is paving the way for the future of data connectivity, addressing the rapidly increasing needs for more speed and better power efficiency in the age of AI,” said Gregg Bartlett, Chief Technology Officer at GF. “Through this collaboration with Teramount we look forward to providing our customers with an additional scalable solution for the future of ultra-fast and efficient data movement.”