The only solution for scalable fiber connectivity to photonic chips

Ahead of the curve

There is an ever-growing demand for high-speed data transfer in datacom and telecom applications.
Optical connectivity is the ultimate solution for high-speed data transfer. Without it, the existing copper-based interconnect technologies will reach their performance limit.

data centers

Silicon photonics
Transceivers and Switches

Advanced computing

Chip-to-chip optical


silicon photonics connectivity for automotive, indsutrial and medical sensors

5G networks

telecom applications

The I/O bottleneck

Data transfer is limited by copper I/Os

The connection between optics and silicon is not reliable enough. Not yet.

We know how to change this.

Our Solution

We found a way to bring the worlds of optics and
semiconductor technologies together. We can achieve 100X better tolerance when connecting a large number of optical fibers with a silicon chip compared to existing technologies.

We call our solution:
The PhotonicPlug

Our Technology

Seamlessly connects optics to chips.


Utilizes Teramount patented “self-aligning optics” for 100 times better tolerances for connecting single-mode fibers to silicon chips compared to existing coupling techniques.


Allows assembly of fiber high count for co-packaged optics and multi-fiber connectivity applications

Manufacturing scalability

Aligns photonics with the mature semiconductor manufacturing and packaging lines for photonics mass production


Incorporates wafer level testing elements (PhotonicBump) for reliable and high yield silicon photonics manufacturing and packaging
More on our technology

Our Products

The PhotonicPlug

Our PhotonicPlug product connects single-mode fibers to silicon photonic chips.
It enables large number of fiber connectivity in transceivers, sensors and co-packaged optics for switches and advanced computing.

Photonics can be seamlessly integrated with electronics and our customers can benefit from high volume manufacturing of high-bandwidth and low power products.

We are ready to make it happen.

Our Products


News and innovations from Teramount

Check out our recent publication in Chip Scale Review where you can learn about Teramount’s groundbreaking Photonic Bump technology. The...

7 June, 2022

| Teramount

Read Michael Eisenstein’s piece about Teramount’s exciting technology and how it relates to fabrication trends in light of...

6 June, 2022

| Photonics Spectra - Jun 2022

ST. FLORIAN, Austria and JERUSALEM, March 2, 2022 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer...

2 March, 2022

| Teramount; EV Group