Teramount News

A new white paper from Teramount explores how a Detachable Fiber Assembly (DFA) addresses the challenges of Co-Packaged Optics

A new white paper details the challenges of ever-growing data center connectivity demand, existing approaches shortcomings, CPO as a technological solution and DFA as the way to realize that solution.
18 September, 2023

Teramount Ltd.

Abstract: To overcome the bandwidth constraints of copper interconnects and pluggable optics in next-generation data centers, particularly for artificial intelligence (AI) and machine learning applications, a new silicon-photonics solution in the form of co-packaged optics (CPO) with detachable fiber assembly (DFA) is needed that can support semiconductor-grade manufacturing and serviceability in the field.

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