A new white paper from Teramount explores how a Detachable Fiber Assembly (DFA) addresses the challenges of Co-Packaged Optics
A new white paper details the challenges of ever-growing data center connectivity demand, existing approaches shortcomings, CPO as a technological solution and DFA as the way to realize that solution.
Abstract: To overcome the bandwidth constraints of copper interconnects and pluggable optics in next-generation data centers, particularly for artificial intelligence (AI) and machine learning applications, a new silicon-photonics solution in the form of co-packaged optics (CPO) with detachable fiber assembly (DFA) is needed that can support semiconductor-grade manufacturing and serviceability in the field.
