Teramount and ASMPT AMICRA Collaborate to Advance Silicon Photonics Packaging
The collaboration is aimed at addressing the challenge of connecting fibers to silicon photonic chips.
Teramount Ltd. and ASMPT AMICRA GmbH are collaborating to address the challenge of connecting fibers to silicon photonic chips, based on placement of Teramount’s pioneering wafer-level self-aligning optical elements on customer’s SiPh wafers using ASMPT’s advanced precision die attach machinery: Business Wire.
